Founded in 1977 by Casey Kazmierowicz, the company’s original purpose was to monitor 1,832☏ (1,000☌) conveyor ovens. KIC is a specialist in production of automated thermal process tools and systems for reflow, wave, curing, and semiconductor thermal processes. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access. All in the Family: Family Businesses of the Electronics Industry. The process control computer is equipped with a user-friendly touch screen for operating, process profile editing and recipe storing. All systems are suited for 100% paste and flux. The void-affected area can be reduced to less than 1% whereas common reflow soldering systems range at 5%.Ĭ.VACUNITE systems ensure fast heat-up and cool-down rates for short cycle times and reach temperatures up to 450 ☌.Ĭ.VACUNITE vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% hydrogen (H 2), formic acid (HCOOH) or forming gas (N 2H 2). Profile feature Lead-free assembly Average ramp-up rate (Tsmax to TP) 3 ☌/second max. All temperatures refer to topside of the package, measured on the body surface. What is Reflow:- Reflow soldering is a process in which a solder paste is used to create a permanent joint between components to their contact pads.Types o. JEDEC standard Lead-free reflow profile (according to J-STD-020D) (1) 1. Vacuum reflow profile setup with Heller’s user interface. Recommended reflow soldering profile Table 3. The reflow oven is used primarily for the reflow soldering of surface mount electronic components to printed circuit boards (PCB). Systems with 6 to 16 measurement channels. SLX Full Brochure (English) Reflow temperature profiler and software for SMT profile setup, optimisation and verification. Automatic thermocouple and temperature status checking. X-ray void analysis should be performed after each iteration to ensure the correct progress is made towards optimizing your vacuum profile. User replaceable high temperature battery. In the field of vacuum soldering the systems meet highest requirements of voidless soldering for Advanced Packaging and Power Semiconductor applications. Ramp-to-Spike (RTS) Profile: The Ramp-to-Spike (RTS) profile is another temperature profile often used in reflow soldering. Developing the correct vacuum profile (pump-down rates, vacuum level, dwell times) can be a balancing act that may take a few iterations to optimize. The use of a workpiece carrier is not necessary here. Today, the soldering procedure can be individually regulated, and may include a vacuum module for void-free soldering. The versions 24, 12 and 6 are designed for process performance-based R&D and pilot scale production. How are products transported in inline systems As is usual with convection soldering systems, the products are transported individually through the system. The centrotherm c.VACUNITE contact heat system platform covers a wide range of thermal vacuum applications.
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